Due to accelerating demands for AI

 The new ONYX 3200 metrology system is designed to improve yield and quality in advanced semiconductor packaging and BEOL processes by enabling precise, non-destructive measurement of ultra-fine metal layers and interconnect structures. Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) announced the launch of the ONYX 3200, a new semiconductor metrology system to measure film thickness, composition and bump* structures for wafer-level processes. The system is engineered to help manufacturers stabilize quality and increase yield in the metal-wiring formation (back-end-of-line (BEOL)) and packaging processes of semiconductor chips.

ONYX 3200

Due to accelerating demands for AI, high-performance computing, data centers, mobile devices, and other devices, chip wiring and interconnect structures have grown increasingly delicate and complex. As a result, the ability to accurately and non-destructively measure metal layers thinner than a human hair and bumps under 10 µm, especially in BEOL and packaging processes, has become critically important since reliability and uniformity directly influence final device performance

The ONYX 3200 meets these requirements and offers another significant advantage: it enables measurement of complex metal layers in bumps, previously requiring multiple instruments, using a single platform.

* Microscopic regions of raised metal used to connect between semiconductor chips and to circuit board

Features of the ONYX 3200

High-precision bump metrology using a 3D confocal scanner

The ONYX 3200 can inspect the shapes and heights of microscopic bumps and electroconductive metal patterns in 3D with high precision. Bumps consist of lower layers of copper, nickel, or similar materials beneath an upper layer of tin and silver. Conventional metrology methods result in absorption by the upper layer, making simultaneous measurement of upper and lower layers impossible. The ONYX 3200 integrates an optical scanner to capture the overall bump shape and total height and a fluorescent X-ray detector which is used to measure the upper metal layer thickness. Subtraction of these values enables precise calculation of the lower metal layers, establishing a baseline for ensuring robust interconnect reliability.

Original dual-head, microfocus X-ray source

The ratio of materials in a tin-and-silver (SnAg) bump has significant impact on the reliability of packaging connections. Rigaku has developed a unique, dedicated X-ray head capable of detecting silver content as low as 2% within SnAg bumps with an exceptional precision of 4 parts per 100,000 providing rigorous materials ratio control for packaging yield. Moreover, the dual-head architecture enables simultaneous measurements of the wide range of metal features around chip interconnects, improving throughput and analytical flexibility.

Market Outlook

Rigaku has shipped an initial ONYX 3200 system to a major global foundry for deployment in an advanced packaging line and is currently receiving strong interest from leading semiconductor manufacturers worldwide. The company targets JPY 1.5 billion in ONYX 3200 sales in FY2026, with plans to double to JPY 3 billion in FY2027 as adoption expands across packaging and BEOL applications.

Rigaku Corp., a global solution partner in X-ray analytical systems and part of Rigaku Holdings Corp., has launched the ONYX 3200, a next-generation semiconductor metrology system aimed at addressing growing complexity in chip manufacturing. The new platform is designed to support wafer-level processes by accurately measuring film thickness, material composition, and microscopic bump structures used in advanced packaging and back-end-of-line (BEOL) production.

As demand surges for artificial intelligence, high-performance computing, data centres, and advanced mobile devices, semiconductor interconnects have become thinner and more intricate. Manufacturers now require highly precise and non-destructive measurement tools to ensure reliability, as even minor variations in metal wiring or bumps can significantly impact final device performance. The ONYX 3200 is built to meet these stringent requirements, enabling stable quality control and improved production yields.

Advanced measurement capabilities

A key strength of the ONYX 3200 lies in its ability to measure complex bump structures using a single system. Traditionally, analysing multiple metal layers required several instruments. Rigaku’s new solution integrates a 3D confocal optical scanner with fluorescent X-ray technology, allowing detailed inspection of bump shape, height, and metal layer thickness. This combined approach enables accurate calculation of underlying copper or nickel layers beneath tin and silver coatings, helping manufacturers ensure robust interconnect reliability.

The system also features a proprietary dual-head, microfocus X-ray source. This allows precise detection of material ratios in tin-silver bumps, including silver content as low as 2 percent, with extremely high accuracy. Such control is critical for maintaining packaging strength and long-term device performance, while also improving throughput and analytical flexibility.

By: Advik Gupta